Corsair Dominator GT 4GB (2x2GB) DDR3 Ram (CMG4GX3M2B1600C7)

Dominator® GT is the ultimate performance memory solution within the Dominator product line. Limited to only extremely high memory speeds, Corsair Dominator GT only uses highly screened IC’s to guarantee performance and over-clockability.

Using ultra efficient Dual-path Heat Xchange (DHX) cooling technology, Dominator GT DDR3 memory modules also ship with the Airflow Fan to maximize heat transfer away from the modules all the while being stable and reliable. With removable heat sinks, Corsair Dominator GT DDR3 memory modules can even be outfitted with additional upcoming accessories with enhanced features.

Very few components make it into the Dominator family. Even fewer are hand selected to build Dominator GT DDR3 memory. Corsair’s team of engineers run extensive and exhaustive in-house testing and qualification with the premium performance motherboards used by overclockers and ultra enthusiasts.

This unique combination of over-clocking performance testing and guaranteed reliability and compatibility coupled with a limited lifetime warranty, make Dominator GT DDR3 memory the cream of the crop, and the ultimate solution for the ultra enthusiast and overclocker

Dominator GT The Ultimate Memory Module from Corsair
Very few components make it into the Dominator family. Corsair performs rigorous testing and screening on all components to select only the best for Dominator memory modules. The tests check for high frequency and/or low latency capabilities for each IC. Then, they are thoroughly tested for maximum interoperability and reliability as a united group to meet the stringent design criteria demanded by performance computing and gaming users.

Superior Heat Dissipation
Heat is the enemy of your computer’s key components. And the more you tweak components for performance, the more heat is generated. Heat will slow down your system and impact long term reliability. With traditional DDR3 memory, the standard method of chip packaging involves a BGA (Ball Grid Array). In a BGA, small balls of solder, organized as a grid, are the leads that connect the device to the module circuit board. A Micron Semiconductor study shows that in a BGA memory device as much as 50% of the heat generated by the chip is actually conducted into the circuit board. Since traditional heat sinks are only attached to the front surface of memory chips, there’s no easy thermal path for the heat coming from the back of the chips.

Corsair’s Unique Dual-path Heat Xchange (DHX) Solves the Problem
Corsair’s engineers have developed a unique technology that maximizes heat dissipation while improving reliability, even in the most extremely overclocked memory module. Dual-Path Heat Exchange (DHX) technology utilizes two methods to effectively remove heat from the memory circuit board Convection and Conduction.

Technical Details

• Brand : Corsair
• Model : CMG4GX3M2B1600C7
• Speed Rating : PC3-12800 
• Tested Speed :1600Mhz 
• Size : 4GB Kit (2 x 2GB) 
• Tested Latency : 7-7-7-20 
• Tested Voltage : 1.65 
• Performance Profile : BEMP 
• SPD Speed : 1333Mhz  
• SPD Latency : 9-9-9-24 
• Package : 240pin DIMM 
• Fan Included : No