Gigabyte B760M DS3H AX DDR5 Intel Motherboard

  Feature
Intel® Socket LGA 1700：Support 13th and 12th Gen Series Processors
Unparalleled Performance：Hybrid 6+2+1 Phases Digital VRM Solution
Dual Channel DDR5：4*DIMMs XMP Memory Module Support
Next Generation Storage：2*PCIe 4.0 x4 M.2 Connectors
M.2 Thermal Guard：To Ensure M.2 SSD Performance
EZ-Latch：PCIe 4.0x16 Slot with Quick Release Design
Fast Networks：2.5GbE LAN & Wi-Fi 6E 802.11ax
Extended Connectivity：Rear USB-C® 10Gb/s, DP, HDMI
Smart Fan 6：Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP
Q-Flash Plus：Update BIOS Without Installing the CPU, Memory and Graphics Card
 
6+2+1 Phases Hybrid Digital VRM Design
6+2+1 Phases Low RDS(on) MOSFETs, Premium Choke and Capacitors to improve transient response and minimize oscillation
 
THERMAL
Enlarged Surface Design of MOSFET Heatsink greatly improves heat dissipation.
 
CONNECTIVITY
GIGABYTE Motherboards enable the ultimate connection experience with blazing data-transfer speeds through the next generation network, storage and Wi-Fi connectivity.
 
PERSONALIZATION
GIGABYTE motherboards bundle several useful and intuitive software to help users to control every aspect of motherboard and provide customizable lighting effect with outstanding aesthetics to fit your unique personality.
 
Technical Detail
Brand : Gigabyte
Modal : B760M DS3H AX
 
Technical Spec
CPU
LGA1700 socket: Support for the 13th and 12th Generation Intel® Core™, Pentium® Gold and Celeron® Processors
L3 cache varies with CPU
 
Chipset
Intel® B760 Express Chipset
 
Memory
Support for DDR5 7600(O.C.) /7400(O.C.) /7200(O.C.) /7000(O.C.) /6800(O.C.) /6600(O.C.) / 6400(O.C.) / 6200(O.C.) / 6000(O.C.) / 5800(O.C.) / 5600(O.C.) / 5400(O.C.) / 5200(O.C.) / 4800 / 4000 MT/s memory modules
4 x DDR DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory, Dual channel memory architecture
Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode), Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules  Support for Extreme Memory Profile (XMP) memory modules
 
Onboard Graphics
Integrated Graphics Processor-Intel® HD Graphics support:
1 x HDMI port, supporting a maximum resolution of 4096x2160@60 Hz
Support for HDMI 2.0 version and HDCP 2.3.
1 x DisplayPort, supporting a maximum resolution of 4096x2304@60 Hz
Support for DisplayPort 1.2 version and HDCP 2.3
1 x DisplayPort, supporting a maximum resolution of 4096x2304@60 Hz
Support for DisplayPort 1.2 version.
 
Audio
Realtek® Audio CODEC
High Definition Audio
2/4/5.1/7.1-channel
You can change the functionality of an audio jack using the audio software. To configure 7.1-channel audio, access the audio software for audio settings.
Support for S/PDIF Out
 
LAN
Realtek® 2.5GbE LAN chip (2.5 Gbps/1 Gbps/100 Mbps)
 
Wireless Communication module
AMD Wi-Fi 6E RZ608 (MT7921K) (For PCB rev. 1.0)
WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands ,BLUETOOTH 5.2
Support for 11ax 80MHz wireless standard and up to 1.2 Gbps data rate, Intel® Wi-Fi 6E AX210 (For PCB rev. 1.1)
WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands, BLUETOOTH 5.3
Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate, Intel® Wi-Fi 6E AX211 (For PCB rev. 1.2)
WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands, BLUETOOTH 5.3
Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate, Realtek® Wi-Fi 6E RTL8852CE (For PCB rev. 1.3)
WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands, BLUETOOTH 5.3
Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate
 
Expansion Slots
CPU: 1 x PCI Express x16 slot, supporting PCIe 4.0 and running at x16
Chipset: 2 x PCI Express x1 slots, supporting PCIe 3.0 and running at x1
 
Storage Interface
CPU: 1 x M.2 connector (Socket 3, M key, type 2280 PCIe 4.0 x4/x2 SSD support) (M2A_CPU)
Chipset: 1 x M.2 connector (Socket 3, M key, type 2280 PCIe 4.0 x4/x2 SSD support) (M2P_SB)
4 x SATA 6Gb/s connectors
RAID 0, RAID 1, RAID 5, and RAID 10 support for SATA storage devices 
 
USB
Chipset: 1 x USB Type-C® port on the back panel, with USB 3.2 Gen 2 support
5 x USB 3.2 Gen 1 ports (3 ports on the back panel, 2 ports available through the internal USB header)
2 x USB 2.0/1.1 ports on the back panel
Chipset+2 USB 2.0 Hubs: 4 x USB 2.0/1.1 ports available through the internal USB headers
 
Internal I/O Connectors
1 x 24-pin ATX main power connector
1 x 8-pin ATX 12V power connector
1 x CPU fan header
3 x system fan headers
1 x addressable LED strip header
1 x RGB LED strip header
2 x M.2 Socket 3 connectors
4 x SATA 6Gb/s connectors
1 x front panel header
1 x front panel audio header
1 x USB 3.2 Gen 1 header
2 x USB 2.0/1.1 headers
1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 module only)
1 x S/PDIF Out header
1 x Q-Flash Plus button
1 x reset jumper
1 x Clear CMOS jumper
 
Back Panel Connectors
2 x USB 2.0/1.1 ports
1 x PS/2 keyboard/mouse port
2 x SMA antenna connectors (2T2R)
1 x HDMI port
2 x DisplayPorts
3 x USB 3.2 Gen 1 ports
1 x USB Type-C® port, with USB 3.2 Gen 2 support
1 x RJ-45 port
3 x audio jacks
 
I/O Controller
iTE® I/O Controller Chip
 
H/W Monitoring
Voltage detection
Temperature detection
Fan speed detection
Water cooling flow rate detection
Fan fail warning
Fan speed control
 
BIOS
1 x 128 Mbit flash
Use of licensed AMI UEFI BIOS
PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0
 
Unique Features
Support for GIGABYTE Control Center (GCC)
Available applications in GCC may vary by motherboard model. Supported functions of each application may also vary depending on motherboard specifications.
Support for Q-Flash
Support for Q-Flash Plus
 
Operating System
Support for Windows 11 64-bit
Support for Windows 10 64-bit
 
Form Factor
Micro ATX Form Factor; 24.4cm x 24.4cm