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Gigabyte B560M DS3H V3 DDR4 Intel Motherboard

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Features

Gigabyte B560M DS3H V3 DDR4 Intel Motherboard
PERFORMANCE
4+2 Hybrid Digital VRM with Low RDS(on) MOSFET

GIGABYTE motherboards use Low RDS(on) MOSFETs which reduce energy wastage through unnecessary residual heat dissipation. This all amounts to tangible energy saving which are beneficial for both end-users and the environment without impacting system performance

Benefits of Low RDS(on) MOSFETs
Optimized gate charge to minimize switching losses
Lower temperature, smaller size, better thermal characteristics

NVMe PCIe Gen3 X4 22110 M.2 Connector
GIGABYTE Motherboards are focused on delivering M.2 technology to enthusiasts who want to maximize their system’s potential.

2-Way CrossFire™ Multi-Graphics
Multi-graphics configuration offers better graphics performance for gaming enthusiasts who demand the highest frame rates without compromising on resolution.

Intel® GbE LAN with cFosSpeed Internet Accelerator Networking
Intel® GbE LAN features cFosSpeed, a network traffic management application which helps to improve network latency and maintain low ping times to deliver better responsiveness in crowded LAN environments.

The Industry's Leading LAN Static-Electricity & Surge Protection
GIGABYTE motherboards use ICs with up to 3 times the ESD resistance levels compared to traditional ICs. This helps to better protect the motherboard and its components against potential damage caused by static electricity. GIGABYTE motherboards also feature special anti-surge ICs that protect your motherboard, and your PC from any surge in power delivery that may occur, helping to ensure that your PC is equipped to deal with any potentially irregular and inconsistent power delivery.

High Definition Digital Outputs
Enjoy true HD display capability using the most commonly integrated digital output technologies on today’s HD displays and TVs

Smart Fan 5
With Smart Fan 5 users can ensure that their gaming PC can maintain its performance while staying cool. Smart Fan 5 allows users to interchange their fan headers to reflect different thermal sensors at different locations on the motherboard. Not only that, with Smart Fan 5 more hybrid fan headers that support both PWM and Voltage mode fans have been introduced to make the motherboard more liquid cooling friendly.

Hybrid Fan Pin Headers
Assume complete control over your liquid cooling setup! Smart Fan 5 receives up-to-the-second information on flow-rate and water-temperature through the Hybrid Fan Pin Headers—giving you absolute mastery over your PC.

New Smart Fan 5 Software
Choose from different modes, Quiet to Full Speed, to match your system usage preferences.
For each fan or pump, you can use the intuitive fan curve to define trigger thresholds and corresponding fan speeds.

LIGHTING
RGB FUSION 2.0

With H470 Motherboards, RGB Fusion 2.0 is even better with Addressable LEDs.* RGB Fusion 2.0 offers users the option to control onboard RGB and external RGB / Addressable LED light strips for their PC. Already feature filled with colors and patterns, RGB Fusion 2.0 on H470 Series Motherboards are now upgraded with Addressable LED support. With external Addressable LED strips*, where each LED is digitally addressable, users can experience even more patterns, styles, and illuminations.

High-End Audio Capacitors
GIGABYTE motherboards use high-end audio capacitors. These high quality capacitors help deliver high resolution and high fidelity audio to provide the most realistic sound effects for gamers.

Audio Noise Guard
GIGABYTE motherboards feature an audio noise guard that essentially separates the board’s sensitive analog audio components from potential noise pollution at the PCB level

Features
Intel® Ultra Durable Motherboard with Intel® GbE with cFosSpeed, PCIe Gen3 x4 M.2,  HDMI / DVI-D/ D-Sub Ports for Multiple Display, Anti-Sulfur Resistor, Smart Fan 5, RGB FUSION 2.0
Supports 10th Gen Intel® Core™ Processors and 11th Gen Intel® Core™ Processors*
Dual Channel Non-ECC Unbuffered DDR4, 4 DIMMs
NVMe PCIe Gen3 X4 M.2 Connectors
Smart Fan 5 Features Multiple Temperature Sensors,Hybrid Fan Headers with FAN STOP
Intel® Optane™ Memory Ready
Intel® GbE LAN with cFosSpeed Internet Accelerator Software
3 Display Interfaces Support
RGB FUSION 2.0 with Multi-Zone Addressable LED Light Show Design, Support Addressable LED & RGB LED Strips
Anti-Sulfur Resistors Design
Q-Flash Plus Update BIOS without Installing the CPU、Memory and Graphics Card

Technical Detail
Brand : Gigabyte
Model : B560M DS3H V3

Technical Spec
CPU

LGA1200 package:
11th Generation Intel® Core™ i9 processors / Intel® Core™ i7 processors / Intel® Core™ i5 processors
10th Generation Intel® Core™ i9 processors / Intel® Core™ i7 processors / Intel® Core™ i5 processors / Intel® Core™ i3 processors/ Intel® Pentium® processors / Intel® Celeron® processors
L3 cache varies with CPU

Chipset
Intel® H470 Express Chipset

Memory
11th Generation Intel® Core™ i9/i7/i5 processors:
Support for DDR4 3200/3000/2933/2666/2400/2133 MT/s memory modules
10th Generation Intel® Core™ i9/i7 processors:
Support for DDR4 2933/2666/2400/2133 MT/s memory modules
10th Generation Intel® Core™ i5/i3/Pentium®/Celeron® processors:
Support for DDR4 2666/2400/2133 MT/s memory modules
4 x DDR4 DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory
Dual channel memory architecture
Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode)
Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules
Support for Extreme Memory Profile (XMP) memory modules

Onboard Graphics
Integrated Graphics Processor-Intel® HD Graphics support:
1 x D-Sub port, supporting a maximum resolution of 1920x1200@60 Hz
1 x DVI-D port, supporting a maximum resolution of 1920x1200@60 Hz
1 x HDMI port, supporting a maximum resolution of 4096x2160@30 Hz
Support for up to 3 displays at the same time
Maximum shared memory of 512 MB

Audio
Realtek® Audio CODEC
High Definition Audio
2/4/5.1/7.1-channel

LAN
Intel® GbE LAN chip (1 Gbps/10 Mbps/100 Mbps)

Expansion Slots
1 x PCI Express x16 slot, running at x16 (PCIEX16)
1 x PCI Express x16 slot, running at x4 (PCIEX4)
2 x PCI Express x1 slots

Storage Interface
1 x M.2 connector (Socket 3, M key, type 22110/2280/2260/2242 PCIe x4/x2 SSD support)
4 x SATA 6Gb/s connectors
Support for RAID 0, RAID 1, RAID 5, and RAID 10

USB
Chipset:
5 x USB 3.2 Gen 1 ports (3 ports on the back panel, 2 ports available through the internal USB header)
6 x USB 2.0/1.1 ports (2 ports on the back panel, 4 ports available through the internal USB headers)

Internal I/O Connectors
1 x 24-pin ATX main power connector
1 x 8-pin ATX 12V power connector
1 x CPU fan header
1 x system fan header
1 x addressable LED strip header
1 x RGB LED strip header
1 x M.2 Socket 3 connector
4 x SATA 6Gb/s connectors
1 x front panel header
1 x front panel audio header
1 x USB 3.2 Gen 1 header
2 x USB 2.0/1.1 headers
2 x Thunderbolt™ add-in card connectors
1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0/GC-TPM2.0 SPI V2 module only)
1 x serial port header
1 x Clear CMOS jumper
1 x Q-Flash Plus button

Back Panel Connectors
1 x PS/2 keyboard/mouse port
1 x D-Sub port
1 x DVI-D port
1 x HDMI port
3 x USB 3.2 Gen 1 ports
2 x USB 2.0/1.1 ports
1 x RJ-45 port
3 x audio jacks

I/O Controller
iTE® I/O Controller Chip

H/W Monitoring
Voltage detection
Temperature detection
Fan speed detection
Overheating warning
Fan fail warning
Fan speed control

BIOS
1 x 256 Mbit flash
Use of licensed AMI UEFI BIOS
PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0

Unique Features
Support for APP Center
@BIOS
EasyTune
RGB Fusion
Smart Backup
System Information Viewer
Support for Q-Flash Plus
Support for Q-Flash
Support for Xpress Install

Bundled Software
Norton® Internet Security (OEM version)
LAN bandwidth management software

Operating System
Support for Windows 11 64-bit
Support for Windows 10 64-bit

Form Factor
Micro ATX Form Factor; 24.4cm x 24.4cm

Specifications

Model
Brand  GIGABYTE
Model  B560M DS3H V3
Supported CPU
CPU Socket Type  LGA 1200
CPU Type  11th Generation Intel® Core™ i9 processors / Intel® Core™ i7 processors / Intel® Core™ i5 processors 10th Generation Intel® Core™ i9 processors / Intel® Core™ i7 processors / Intel® C
Chipsets
Chipset  Intel H470 Express Chipset
Memory
Number of Memory Slots  4 x DDR4 DIMM Slots
Memory Standard  11th Generation Intel® Core™ i9/i7/i5 processors: Support for DDR4 3200/3000/2933/2666/2400/2133 MT/s memory modules 10th Generation Intel® Core™ i9/i7 processors: Support for DDR4 2933/2666/
Maximum Memory Supported  up to 128 GB
Channel Supported  Dual channel memory architecture
Expansion Slots
PCI Express x1  2 x PCI Express x1 slots
PCI Express x16  1 x PCI Express x16 slot, running at x16 (PCIEX16)
Storage Devices
SATA 3Gb/s  4 x SATA 6.0 Gb/s Connectors
SATA RAID  Support Raid 0, 1, 5, 10
Onboard Video
Onboard Audio
Audio Channels  2/4/5.1/7.1-channel
Audio Chipset  Realtek audio codec
Onboard LAN
LAN Chipset  Intel GbE LAN chip (1 Gbps/10 Mbps/100 Mbps)
Rear Panel Ports
USB  3 x USB 3.2 Gen 1 ports 2 x USB 2.0/1.1 ports
IEEE 1394  N/A
S/PDIF Out  N/A
Audio Ports  3 x audio jacks
PS/2  1 x PS/2 keyboard/mouse port
Video Ports  1 x D-Sub port 1 x DVI-D port 1 x HDMI port 1 x RJ-45 port
HDMI  1 x HDMI Port
Onboard USB
Onboard USB  Chipset: 5 x USB 3.2 Gen 1 ports (3 ports on the back panel, 2 ports available through the internal USB header) 6 x USB 2.0/1.1 ports (2 ports on the back panel, 4 ports available through the intern
Onboard 1394
Onboard 1394  N/A
Physical Spec
Form Factor  Micro ATX Form Factor
Power Pin  1 x 24-pin ATX main power connector 1 x 8-pin ATX 12V power connector
Dimensions  24.4cm x 24.4cm

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